Fully Automatic Atmospheric Pressure Sputtering System
Reducing the cost of manufacturing processes (replacing expensive vacuum equipment) by 3D-metallization on complex geometries, e.g. harsh-environment sensor housings.
Direct deposition of wire leads and bond pads (electrical connection between sensor element and periphery) on insulators by sputtering process at atmospheric pressure.
Coating materials: Au, Pt, Pd, Ag
Substrate sizes: no process limits, depending on application, e.g. 7 mm long, diameter 6 mm
Throughput: depending on application, e.g. 32 pcs/day
Supplies: 230 V / 50 Hz, compressed air, Helium
Control, operation: PLC, PC with touch panel monitor