3DWire

Fully Automatic Atmospheric Pressure Sputtering System

Motivation:

Reducing the cost of manufacturing processes (replacing expensive vacuum equipment) by 3D-metallization on complex geometries, e.g. harsh-environment sensor housings.

Solution:

Direct deposition of wire leads and bond pads (electrical connection between sensor element and periphery) on insulators by sputtering process at atmospheric pressure.

Technical Data:

Coating materials: Au, Pt, Pd, Ag

Substrate sizes: no process limits, depending on application, e.g. 7 mm long, diameter 6 mm          

Throughput: depending on application, e.g. 32 pcs/day

Supplies: 230 V / 50 Hz, compressed air, Helium

Control, operation: PLC, PC with touch panel monitor